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CKUIR > administration > Journal of Deh Yu > Journal of Deh Yu 08 >  Item 987654321/165

Please use this identifier to cite or link to this item: https://dyhuir.dyhu.edu.tw/ir/handle/987654321/165

Title: 熱風溫度與豆渣比例對豆渣乾燥物物化特性之影響
Authors: 施明智;江文章
Keywords: 比例;豆渣;物化;乾燥物;溫度;熱風
Date: 1992/10
Issue Date: 2011-08-09T06:10:45Z
Abstract: 豆渣為黃豆磨成豆漿後剩下的半固體殘渣為一含有高水分,高蛋白質及高膳食纖維的食物基質。本研究目的探討以豆渣與穀物粉混和乾燥之可行性,並利用擠壓技術製造濕狀半成後品後,探討乾燥對產品物化特性之影響。
以不同豆渣與米穀粉混合比例,及不同乾燥溫度試驗發現:混合物中豆渣的添加量增加時,乾燥產物的容量比重降低,保水性則增大。熱風溫度高時,乾燥產物有表面硬化現象,使保水性降低,容積比重減小,但糊化度,水溶性指標(WSI)及水溶性碳水化合物(WSC)則增加。
以基本配方為玉米粉:豆渣:米穀粉=81.8:10:8.2(原料乾物重比)之混合物以1000mm長隻雙軸擠壓機製成濕狀半成品時發現,乾燥過之基本配方復水後再擠壓、烘烤者,與對照組(未經乾燥者)之嗜好性品評分數無差異。
Soybean residue is the solid waste of soymilk or tofu processing, and it's a good food ingredient, high in moisture, protein and dietary fiber. This study was con-ducted to investigate the possibility of drying the mixture containing the soybean re-sidue and grain flours, the physicochemical changed of corn-based extruded semi-producf during the extrusion of soybean residue dried products.
The different mixture ratios of soybean residue to rice flour, and drying temper-atures were investigated. The result showed that the more soybean residue in the mixture, the lower was the bulk deensity, and the higher was the water holding capacity of the product. Case hardening occurred in the product when dried at higher temperature, and it resulted in decreases of water holding capacity and bulk density, but in increases of the degree of gelatinization, water soluble index(WSI) and water soluble carbohydrate(WSC).
While the basic formula(corn flour: soybean residue:rice flour=81.8: 10: 8.2, dry weight basis) was extruded with 1000mm length of twin-screw extruder, the re-sult showed that when the dried mixture was rehydrated and used to make baked product, the sensory evaluation scroes showed that there were not different between control(wet soybean residue and grain flours mixture) and rephydration sample.
Relation: 德育學報第八期:001-016
Appears in Collections:[Journal of Deh Yu] Journal of Deh Yu 08

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